Robust Low Power VLSI
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Author Title Type [ Year(Desc)]
Filters: Author is Daniel S. Truesdell  [Clear All Filters]
2023
X. Liu, Truesdell, D. S., Faruqe, O., Parameswaran, L., Rickley, M., Kopanski, A., Cantley, L., Coon, A., Bernasconi, M., Wang, T., and Calhoun, B. H., “A Self-Powered SoC with Distributed Cooperative Energy Harvesting and Multi-Chip Power Management for System-in-Fiber”, in IEEE International Solid-State Circuits Conference (ISSCC), 2023.PDF icon 15.1_A_Self-Powered_SoC_with_Distributed_Cooperative_Energy_Harvesting_and_Multi-Chip_Power_Management_for_System-in-Fiber.pdf (1.51 MB)
2025
A. Agrawal, Chen, Z., Desman, B. E., Wang, J., Tanaka, A., Foysal, F., Hess, C. D., Farrell, W., Owens, J., Truesdell, D. S., and Calhoun, B. H., “A 2-Dimensional mm-scale Network-on-Textiles (kNOTs) for Wearable Computing with Direct Die-to-Yarn Integration of 0.6mm x 2.15mm SoC and bySPI chiplets”, in 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025.
A. Tanaka, He, S., Mounesi, R., Liu, X., Faruqe, O., Mim, N. Gahan, Truesdell, D. S., Nasiri, A., and Calhoun, B. H., “An 81.0% Peak Efficiency, 1.0W/cm^3 Miniaturized 5V/1A AC-DC Converter using a Highly-Integrated Primary-Side Active Clamp Flyback Controller with Adaptive Frequency and Zero-Voltage Switching”, in 2025 IEEE Custom Integrated Circuits Conference (CICC), 2025.
Z. Chen, Desman, B. E., Agrawal, A., Farrell, W., Owens, J., Truesdell, D. S., and Calhoun, B. H., “ISPI: A 2-Wire Improved Serial Peripheral Interface with Automatic Routing Algorithm for 2-D In-Textile Distributed Computing and Storage Systems”, in 2025 IEEE Custom Integrated Circuits Conference (CICC) , 2025.
In Press
O. Faruqe, Chen, Z., Bhattacharya, S., Foysal, M. Fahim, Hasan, S., Truesdell, D. S., and Calhoun, B. H., “A 0.36 mm² On-the-Fly I2C-to-SPI Converter for E-Textile Applications”, in 2025 IEEE International Symposium on Circuits and Systems (ISCAS), In Press.
A. Agrawal, Liu, X., Truesdell, D. S., and Calhoun, B. H., “Characterization of Stacked PV Cell Configurations in a Deep N-Well 65nm CMOS Technology”, in 2025 IEEE International Symposium on Circuits and Systems (ISCAS), In Press.
A. Tanaka, He, S., Owens, J., Farrell, W., Lewis, Z., Farrell, T., Truesdell, D. S., and Calhoun, B. H., “A Cooperative 0.6×1.2mm Fully On-chip Switched-Capacitor Voltage Regulator with Communication-free Multi-chip Output Voltage Matching for Distributed Power Management in Networks-on-Textiles”, in 2025 IEEE European Solid-State Electronics Research Conference (ESSERC), In Press.
O. Faruqe, Le, P., Lee, D., Liu, X., Abdelatty, O., Truesdell, D. S., and Calhoun, B. H., “A Fully Integrated, Custom End-to-End PPG Sensing System for Ultra-Low Power Wearables”, in 2025 IEEE International Symposium on Circuits and Systems (ISCAS), In Press.

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