Robust Low Power VLSI
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Author Title Type [ Year(Desc)]
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2021
A. Dissanayake, Bowers, S. M., and Calhoun, B. H., “Stacked Transconductance Boosting for Ultra-Low Power 2.4GHz RF Front-End Design”, in 2021 IEEE International Symposium on Circuits and Systems (ISCAS), 2021.
2022
X. Shen, Duvvuri, D., Bassirian, P., Bishop, H. L., Liu, X., Dissanayake, A., Zhang, Y., Blalock, T. N., Calhoun, B. H., and Bowers, S. M., “A 184 nW, -78.3 dBm Sensitivity Antenna-Coupled Supply, Temperature, and Interference-Robust Wake-up Receiver at 4.9 GHz”, IEEE Transactions on Microwave Theory and Techniques, 2022.
X. Shen, Duvvuri, D., Bassirian, P., Bishop, H. L., Liu, X., Dissanayake, A., Zhang, Y., Blalock, T. N., Calhoun, B. H., and Bowers, S. M., “A 184 nW, -78.3 dBm Sensitivity Antenna-Coupled Supply, Temperature, and Interference-Robust Wake-up Receiver at 4.9 GHz”, IEEE Transactions on Microwave Theory and Techniques, 2022.
2023
L. Zhang, Duvvuri, D., Bhattacharya, S., Dissanayake, A., Liu, X., Bishop, H. L., Zhang, Y., Blalock, T. N., Calhoun, B. H., and Bowers, S. M., “A -102dBm Sensitivity, 2.2µA Packet-Level-Duty-cycled Wake-Up Receiver with ADPLL achieving -30dB SIR”, in IEEE Custom Integrated Circuits Conference (CICC), 2023.
L. Zhang, Duvvuri, D., Bhattacharya, S., Dissanayake, A., Liu, X., Bishop, H. L., Zhang, Y., Blalock, T. N., Calhoun, B. H., and Bowers, S. M., “A -102dBm Sensitivity, 2.2µA Packet-Level-Duty-cycled Wake-Up Receiver with ADPLL achieving -30dB SIR”, in IEEE Custom Integrated Circuits Conference (CICC), 2023.
2024
L. Zhang, Duvvuri, D., Bhattacharya, S., Dissanayake, A., Liu, X., Bishop, H. L., Zhang, Y., Blalock, T. N., Calhoun, B. H., and Bowers, S. M., “A -102 dBm Sensitivity Multi-Channel Heterodyne Wake-Up Receiver with Integrated ADPLL”, IEEE Open Journal of the Solid-State Circuits Society, 2024.
L. Zhang, Duvvuri, D., Bhattacharya, S., Dissanayake, A., Liu, X., Bishop, H. L., Zhang, Y., Blalock, T. N., Calhoun, B. H., and Bowers, S. M., “A -102 dBm Sensitivity Multi-Channel Heterodyne Wake-Up Receiver with Integrated ADPLL”, IEEE Open Journal of the Solid-State Circuits Society, 2024.
2025
A. Agrawal, Chen, Z., Desman, B. E., Wang, J., Tanaka, A., Foysal, F., Hess, C. D., Farrell, W., Owens, J., Truesdell, D. S., and Calhoun, B. H., “A 2-Dimensional mm-scale Network-on-Textiles (kNOTs) for Wearable Computing with Direct Die-to-Yarn Integration of 0.6mm x 2.15mm SoC and bySPI chiplets”, in 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025.
In Press
Z. Chen, Desman, B. E., Agrawal, A., Farrell, W., Owens, J., Truesdell, D. S., and Calhoun, B. H., “ISPI: A 2-Wire Improved Serial Peripheral Interface with Automatic Routing Algorithm for 2-D In-Textile Distributed Computing and Storage Systems”, in 2025 IEEE Custom Integrated Circuits Conference (CICC) , In Press.

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