Robust Low Power VLSI
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A. P. Chandrakasan, Verma, N., Kwong, J., Daly, D., Ickes, N., Finchelstein, D., and Calhoun, B. H., “Micropower Wireless Sensors”, in NSTI Nanotech, 2006, vol. 3, pp. 459-462.
A. Dissanayake, Bishop, H. L., Moody, J., Muhlbauer, H., Calhoun, B. H., and Bowers, S. M., “A Multichannel, MEMS-less -99dBm 260nW Bit-level Duty Cycled Wakeup Receiver”, in 2020 IEEE Symposium on VLSI Circuits (VLSI), 2020.
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T. Ajayi, Kamineni, S., Cherivirala, Y. K., Fayazi, M., Kwon, K., Saligane, M., Gupta, S., Chen, C. - H., Sylvester, D., Blaauw, D., Dreslinski, Jr, R., Calhoun, B., and Wentzloff, D. D., “An Open-source Framework for Autonomous SoC Design with Analog Block Generation”, in 28th IFIP/IEEE International Conference on Very Large Scale Integration, Salt Lake City, UT, USA. (Nominated for Best Paper Award), 2020.
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M. Putic, Di, L., Calhoun, B. H., and Lach, andJohn, “Panoptic DVS: A Fine-Grained Dynamic Voltage Scaling Framework for Energy Scalable CMOS Design”, in International Conference on Computer Design (ICCD), 2009, pp. 491-497.
L. Di, Putic, M., Lach, J., and Calhoun, B. H., “Power Switch Characterization for Fine-Grained Dynamic Voltage Scaling”, in International Conference on Computer Design, pages 605-611, 2008.
S
A. Dissanayake, Bowers, S. M., and Calhoun, B. H., “Stacked Transconductance Boosting for Ultra-Low Power 2.4GHz RF Front-End Design”, in 2021 IEEE International Symposium on Circuits and Systems (ISCAS), 2021.
T
P. Bassirian, Duvvuri, D., Truesdell, D. S., Liu, N. X., Calhoun, B. H., and Bowers, S. M., “A Temperature-robust 27.6nW -65dBm Wakeup Receiver at 9.6GHz X Band”, in 2020 IEEE International Solid-State Circuits Conference (ISSCC), 2020.

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