Publications
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Filters: Author is Benton H. Calhoun [Clear All Filters]
“A 10-Channel, 1.2 µW, Reconfigurable Capacitanceto-Digital Converter for Low-Power, Wearable Healthcare Applications”, in 2023 IEEE Biomedical Circuits and Systems Conference, 2023.
, “A 1pJ/Bit Bypass-SPI Interconnect Bus with I2C Conversion Capability and 2.3nW Standby Power for Fabric Sensing Networks”, in 2023 IEEE Biomedical Circuits and Systems Conference, 2023.
A 1pJbit Bypass-SPI Interconnect Bus with I2C Conversion Capability and 2.3nW Standby Power for Fabric Sensing Networks.pdf (2.54 MB)
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“A 33nW Fully Autonomous SoC with Distributed Cooperative Energy Harvesting and Multi-Chip Power Management for mm-scale System-in-Fiber”, in IEEE Transactions on Biomedical Circuits and Systems, Invited paper, 2023.
A_33nW_Fully_Autonomous_SoC_with_Distributed_Cooperative_Energy_Harvesting_and_Multi-Chip_Power_Management_for_mm-scale_System-in-Fiber.pdf (16.09 MB)
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“AuxcellGen: A Framework for Autonomous Generation of Analog and Memory Unit Cells”, in Design, Automation and Test in Europe Conference (DATE), 2023, 2023.
AuxcellGen-A Framework for Autonomous Generation of Analog and Memory Unit Cells.pdf (3.37 MB)
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“Scalable All-Analog LDOs With Reduced Input Offset Variability Using Digital Synthesis Flow in 65-nm CMOS”, in IEEE Transactions on Very Large Scale Integration (TVLSI) Systems, 2023.
, “A Self-Powered SoC with Distributed Cooperative Energy Harvesting and Multi-Chip Power Management for System-in-Fiber”, in IEEE International Solid-State Circuits Conference (ISSCC), 2023.
15.1_A_Self-Powered_SoC_with_Distributed_Cooperative_Energy_Harvesting_and_Multi-Chip_Power_Management_for_System-in-Fiber.pdf (1.51 MB)
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“A -102 dBm Sensitivity Multi-Channel Heterodyne Wake-Up Receiver with Integrated ADPLL”, IEEE Open Journal of the Solid-State Circuits Society, 2024.
, “A 10-Channel, 120 nW/Channel, Reconfigurable Capacitance-to-Digital Converter for Sub-μW Robust Wearable Sensing”, IEEE Transactions on Biomedical Circuits and Systems, vol. 18, no. 4, 2024.
, “A 2.3-5.7μW Tri-Modal Self-Adaptive Photoplethysmography Sensor Interface IC for Heart Rate, SpO2 , and Pulse Transit Time Co-Monitoring”, IEEE Transactions on Biomedical Circuits and Systems, 2024.
, “A 6nA Fully-Autonomous Triple-Input Hybrid-Inductor-Capacitor Multi-Output Power Management System with Multi-Rail Energy Sharing, All-Rail Cold Startup, and Adaptive Conversion Control for mm-scale Distributed Systems”, in 2024 IEEE International Solid-State Circuits Conference (ISSCC), 2024.
A_6nA_Fully Autonomous_Triple-Input_Hybrid-Inductor-Capacitor_Multi-Output_Power_Management_System_with_Multi-Rail_Energy_Sharing_All-Rail_Cold_Startup_and_Adaptive_Conve.pdf (1.55 MB)
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“Distributed Energy Harvesting and Power Management Units for Self-Powered In-Fabric Sensing Networks”, 2024 IEEE Midwest Symposium on Circuits and Systems (MWSCAS), invited paper, 2024.
, “A Sub-µW Energy-Performance-Aware IoT SoC with a Triple-Mode Power Management Unit for System Performance Scaling, Fast DVFS, and Energy Minimization”, IEEE Journal of Solid-State Circuits, 2024.
A_Sub-_mu_W_Energy-Performance-Aware_IoT_SoC_With_a_Triple_Mode_Power_Management_Unit_for_System_Performance_Scaling_Fast_DVFS_and_Energy_Minimization.pdf (7.38 MB)
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“A 0.36 mm² On-the-Fly I2C-to-SPI Converter for E-Textile Applications”, in 2025 IEEE International Symposium on Circuits and Systems (ISCAS), In Press.
, “A 2-Dimensional mm-scale Network-on-Textiles (kNOTs) for Wearable Computing with Direct Die-to-Yarn Integration of 0.6mm x 2.15mm SoC and bySPI chiplets”, in 2025 IEEE International Solid-State Circuits Conference (ISSCC), In Press.
, “An 81.0% Peak Efficiency, 1.0W/cm^3 Miniaturized 5V/1A AC-DC Converter using a Highly-Integrated Primary-Side Active Clamp Flyback Controller with Adaptive Frequency and Zero-Voltage Switching”, in 2025 IEEE Custom Integrated Circuits Conference (CICC), In Press.
, “Characterization of Stacked PV Cell Configurations in a Deep N-Well 65nm CMOS Technology”, in 2025 IEEE International Symposium on Circuits and Systems (ISCAS), In Press.
, “A Fully Integrated, Custom End-to-End PPG Sensing System for Ultra-Low Power Wearables”, presented at the 2025 IEEE Intern, In Press.
, “ISPI: A 2-Wire Improved Serial Peripheral Interface with Automatic Routing Algorithm for 2-D In-Textile Distributed Computing and Storage Systems”, in 2025 IEEE Custom Integrated Circuits Conference (CICC) , In Press.
, “A Sub-uW Digital Temperature Compensation Architecture for Arbitrary Voltage and Current Reference Generation”, in 2025 IEEE International Symposium on Circuits and Systems (ISCAS), In Press.
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