Publications
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, “A Sub-µW Energy-Performance-Aware IoT SoC with a Triple-Mode Power Management Unit for System Performance Scaling, Fast DVFS, and Energy Minimization”, IEEE Journal of Solid-State Circuits, 2024.
A_Sub-_mu_W_Energy-Performance-Aware_IoT_SoC_With_a_Triple_Mode_Power_Management_Unit_for_System_Performance_Scaling_Fast_DVFS_and_Energy_Minimization.pdf (7.38 MB)
A_Sub-_mu_W_Energy-Performance-Aware_IoT_SoC_With_a_Triple_Mode_Power_Management_Unit_for_System_Performance_Scaling_Fast_DVFS_and_Energy_Minimization.pdf (7.38 MB), “A 2-Dimensional mm-scale Network-on-Textiles (kNOTs) for Wearable Computing with Direct Die-to-Yarn Integration of 0.6mm x 2.15mm SoC and bySPI chiplets”, in 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025.
, “A 2-Dimensional mm-scale Network-on-Textiles (kNOTs) for Wearable Computing with Direct Die-to-Yarn Integration of 0.6mm x 2.15mm SoC and bySPI chiplets”, in 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025.
, “A 0.36 mm² On-the-Fly I2C-to-SPI Converter for E-Textile Applications”, in 2025 IEEE International Symposium on Circuits and Systems (ISCAS), In Press.
, “A 0.36 mm² On-the-Fly I2C-to-SPI Converter for E-Textile Applications”, in 2025 IEEE International Symposium on Circuits and Systems (ISCAS), In Press.
, “An 81.0% Peak Efficiency, 1.0W/cm^3 Miniaturized 5V/1A AC-DC Converter using a Highly-Integrated Primary-Side Active Clamp Flyback Controller with Adaptive Frequency and Zero-Voltage Switching”, in 2025 IEEE Custom Integrated Circuits Conference (CICC), In Press.
, “Characterization of Stacked PV Cell Configurations in a Deep N-Well 65nm CMOS Technology”, in 2025 IEEE International Symposium on Circuits and Systems (ISCAS), In Press.
, “A Fully Integrated, Custom End-to-End PPG Sensing System for Ultra-Low Power Wearables”, in 2025 IEEE International Symposium on Circuits and Systems (ISCAS), In Press.
, “ISPI: A 2-Wire Improved Serial Peripheral Interface with Automatic Routing Algorithm for 2-D In-Textile Distributed Computing and Storage Systems”, in 2025 IEEE Custom Integrated Circuits Conference (CICC) , In Press.
, “ISPI: A 2-Wire Improved Serial Peripheral Interface with Automatic Routing Algorithm for 2-D In-Textile Distributed Computing and Storage Systems”, in 2025 IEEE Custom Integrated Circuits Conference (CICC) , In Press.
, “A Sub-uW Digital Temperature Compensation Architecture for Arbitrary Voltage and Current Reference Generation”, in 2025 IEEE International Symposium on Circuits and Systems (ISCAS), In Press.