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Conference Paper
J. Boley, Chandra, V., Aitken, R., and Calhoun, B. H., Modeling SRAM Dynamic VMIN, in International Conference on IC Design and Technology (ICICDT), 2014.
O. Abdelatty, Bishop, H., Shi, Y., Chen, X., Alghaihab, A., Calhoun, B., and Wentzloff, D., A Low Power Bluetooth Low-Energy Transmitter with a 10.5nJ Startup-Energy Crystal Oscillator, in IEEE European Solid-State Circuits Conference (ESSCIRC), Cracow, Poland, 2019.
O. Abdelatty, Bishop, H., Shi, Y., Chen, X., Alghaihab, A., Calhoun, B., and Wentzloff, D., A Low Power Bluetooth Low-Energy Transmitter with a 10.5nJ Startup-Energy Crystal Oscillator, in IEEE European Solid-State Circuits Conference (ESSCIRC), Cracow, Poland, 2019.
J. Boley, Chandra, V., Aitken, R., and Calhoun, B., Leveraging Sensitivity Analysis for Fast, Accurate Estimation of SRAM Dynamic VMIN, in Design Automation and Test Europe, 2013.
Z. Chen, Desman, B. E., Agrawal, A., Farrell, W., Owens, J., Truesdell, D. S., and Calhoun, B. H., ISPI: A 2-Wire Improved Serial Peripheral Interface with Automatic Routing Algorithm for 2-D In-Textile Distributed Computing and Storage Systems, in 2025 IEEE Custom Integrated Circuits Conference (CICC) , In Press.
O. Faruqe, Le, P., Lee, D., Liu, X., Abdelatty, O., Truesdell, D. S., and Calhoun, B. H., A Fully Integrated, Custom End-to-End PPG Sensing System for Ultra-Low Power Wearables, in 2025 IEEE International Symposium on Circuits and Systems (ISCAS), In Press.
S. Arrabi, Moore, D., Wang, L., Skadron, K., and Calhoun, B. H., Flexibility and Circuit Overheads in Reconfigurable SIMD/MIMD Systems, in International Symposium on Field-Programmable Custom Computing Machines (FCCM), 2014.
H. Qi, Ayorinde, O., and Calhoun, B. H., An Energy-Efficient Near/Sub-Threshold FPGA Interconnect Architecture Using Dynamic Voltage Scaling and Power-Gating, in International Conference on Field-Programmable Technology (ICFPT 2016), Xi’an, China, 2016.
S. Nalam, Chandra, V., Aitken, R. C., and Calhoun, B. H., Dynamic Write Limited Minimum Operating Voltage for Nanoscale SRAM, in Design Automation and Test Europe (DATE), 2011.
P. Beshay, Chandra, V., Aitken, R., and Calhoun, B. H., A Digital Dynamic Write Margin Sensor for Low Power Read/Write Operations in 28nm SRAM, in ISLPED, 2014.
A. Alghaihab, Chen, X., Shi, Y., Truesdell, D. S., Calhoun, B. H., and Wentzloff, D. D., A Crystal-Less BLE Transmitter with -86dBm Frequency-Hopping Back-Channel WRX and Over-the-Air Clock Recovery from a GFSK-Modulated BLE Packet, in 2020 IEEE International Solid-State Circuits Conference (ISSCC), 2020.
A. Agrawal, Liu, X., Truesdell, D. S., and Calhoun, B. H., Characterization of Stacked PV Cell Configurations in a Deep N-Well 65nm CMOS Technology, in 2025 IEEE International Symposium on Circuits and Systems (ISCAS), In Press.
J. B. Stocking, Eberhardt, W. C., Shakhsheer, Y. A., Paulus, J. R., Appleby, M., and Calhoun, B. H., A Capacitance-Based Whisker-like Artificial Sensor for Fluid Motion Sensing, in IEEE Sensors, 2010.
F. Yahya, Lukas, C. J., Breiholz, J., Roy, A., Patel, H. N., Liu, N. X., Chen, X., Kosari, A., Li, S., Akella, D., Ayorinde, O., Wentzloff, D. D., and Calhoun, B. H., A battery-less 507nW SoC with integrated platform power manager and SiP interfaces, in 2017 Symposium on VLSI Circuits, Kyoto, Japan, 2017.
F. Yahya, Lukas, C. J., Breiholz, J., Roy, A., Patel, H. N., Liu, N. X., Chen, X., Kosari, A., Li, S., Akella, D., Ayorinde, O., Wentzloff, D. D., and Calhoun, B. H., A battery-less 507nW SoC with integrated platform power manager and SiP interfaces, in 2017 Symposium on VLSI Circuits, Kyoto, Japan, 2017.
S. Z. Ahmed, Tan, Y., Truesdell, D. S., and Ghosh, A., Auger Effect Limited Performance in Tunnel Field Effect Transistors, in 5th Berkeley Symposium on Energy Efficient Electronics & Steep Transistors Workshop, Berkeley, CA, 2017.
S. Nalam, Chandra, V., Pietrzyk, C., Aitken, R. C., and Calhoun, B. H., Asymmetric 6T SRAM with Two-phase Write and Split Bitline Differential Sensing for Low Voltage Operation, in ISQED, 2010, pp. 139-146.
Y. Shakhsheer, Khanna, S., Craig, K., Arrabi, S., Lach, J., and Calhoun, B. H., A 90nm Data Flow Processor Demonstrating Fine Grained DVS for Energy Efficient Operation from 0.25V to 1.2V, in Custom Integrated Circuits Conference, San Jose, 2011.
R. Agarwala, Wang, P., Tanneeru, A., Lee, B., Misra, V., and Calhoun, B. H., An 88.6nW Ozone Pollutant Sensing Interface IC with a 159 dB Dynamic Range, in ACM/IEEE International Symposium on Low Power Electronics and Design (ISLPED), 2020.
P. Wang, Agarwala, R., Bishop, H. L., Dissanayake, A., and Calhoun, B. H., A 785nW Multimodal (V/I/R) Sensor Interface IC for Ozone Pollutant Sensing and Correlated Cardiovascular Disease Monitoring, in 2020 IEEE Symposium on VLSI Circuits (VLSI), 2020.
X. Liu, Agrawal, A., Tanaka, A., and Calhoun, B. H., A 6nA Fully-Autonomous Triple-Input Hybrid-Inductor-Capacitor Multi-Output Power Management System with Multi-Rail Energy Sharing, All-Rail Cold Startup, and Adaptive Conversion Control for mm-scale Distributed Systems, in 2024 IEEE International Solid-State Circuits Conference (ISSCC), 2024.PDF icon A_6nA_Fully Autonomous_Triple-Input_Hybrid-Inductor-Capacitor_Multi-Output_Power_Management_System_with_Multi-Rail_Energy_Sharing_All-Rail_Cold_Startup_and_Adaptive_Conve.pdf (1.55 MB)
A. Klinefelter, Roberts, N., Shakhsheer, Y., Gonzalez, P., Shrivastava, A., Roy, A., Craig, K., Faisal, M., Boley, J., Oh, S., Zhang, Y., Akella, D., Wentzloff, D. D., and Calhoun, B., A 6.45 μW Self-Powered IoT SoC with Integrated Energy-Harvesting Power Management and ULP Asymmetric Radios, in ISSCC, San Francisco, CA, 2015.
R. Agarwala, Wang, P., and Calhoun, B. H., A 405nW/4.8μW Event-Driven Multi-Modal (V/I/R/C) Sensor Interface for Physiological and Environmental Co-Monitoring, in 2021 IEEE Biomedical Circuits and Systems Conference (BioCAS), 2021.
A. Agrawal, Chen, Z., Desman, B. E., Wang, J., Tanaka, A., Foysal, F., Hess, C. D., Farrell, W., Owens, J., Truesdell, D. S., and Calhoun, B. H., A 2-Dimensional mm-scale Network-on-Textiles (kNOTs) for Wearable Computing with Direct Die-to-Yarn Integration of 0.6mm x 2.15mm SoC and bySPI chiplets, in 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025.
N. X. Liu, Agarwala, R., Dissanayake, A., Truesdell, D. S., Kamineni, S., Chen, X., Wentzloff, D. D., and Calhoun, B. H., A 2.5 ppm/°C 1.05 MHz Relaxation Oscillator with Dynamic Frequency-Error Compensation and 8 µs Start-Up Time, in IEEE European Solid-State Circuits Conference (ESSCIRC), Dresden, Germany, 2018.

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