Publications
“A 1pJ/Bit Bypass-SPI Interconnect Bus with I2C Conversion Capability and 2.3nW Standby Power for Fabric Sensing Networks”, in 2023 IEEE Biomedical Circuits and Systems Conference, 2023.
A 1pJbit Bypass-SPI Interconnect Bus with I2C Conversion Capability and 2.3nW Standby Power for Fabric Sensing Networks.pdf (2.54 MB)
, 
“A 2-Dimensional mm-scale Network-on-Textiles (kNOTs) for Wearable Computing with Direct Die-to-Yarn Integration of 0.6mm x 2.15mm SoC and bySPI chiplets”, in 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025.
, “A 6nA Fully-Autonomous Triple-Input Hybrid-Inductor-Capacitor Multi-Output Power Management System with Multi-Rail Energy Sharing, All-Rail Cold Startup, and Adaptive Conversion Control for mm-scale Distributed Systems”, in 2024 IEEE International Solid-State Circuits Conference (ISSCC), 2024.
A_6nA_Fully Autonomous_Triple-Input_Hybrid-Inductor-Capacitor_Multi-Output_Power_Management_System_with_Multi-Rail_Energy_Sharing_All-Rail_Cold_Startup_and_Adaptive_Conve.pdf (1.55 MB)
, 
“Characterization of Stacked PV Cell Configurations in a Deep N-Well 65nm CMOS Technology”, in 2025 IEEE International Symposium on Circuits and Systems (ISCAS), In Press.
, “ISPI: A 2-Wire Improved Serial Peripheral Interface with Automatic Routing Algorithm for 2-D In-Textile Distributed Computing and Storage Systems”, in 2025 IEEE Custom Integrated Circuits Conference (CICC) , In Press.
, “Distributed Energy Harvesting and Power Management Units for Self-Powered In-Fabric Sensing Networks”, 2024 IEEE Midwest Symposium on Circuits and Systems (MWSCAS), invited paper, 2024.
,