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O. Faruqe, Chen, Z., Bhattacharya, S., Foysal, M. Fahim, Hasan, S., Truesdell, D. S., and Calhoun, B. H., “A 0.36 mm² On-the-Fly I2C-to-SPI Converter for E-Textile Applications”, in 2025 IEEE International Symposium on Circuits and Systems (ISCAS), In Press.
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L. Zhang, Duvvuri, D., Bhattacharya, S., Dissanayake, A., Liu, X., Bishop, H. L., Zhang, Y., Blalock, T. N., Calhoun, B. H., and Bowers, S. M., “A -102 dBm Sensitivity Multi-Channel Heterodyne Wake-Up Receiver with Integrated ADPLL”, IEEE Open Journal of the Solid-State Circuits Society, 2024.
L. Zhang, Duvvuri, D., Bhattacharya, S., Dissanayake, A., Liu, X., Bishop, H. L., Zhang, Y., Blalock, T. N., Calhoun, B. H., and Bowers, S. M., “A -102dBm Sensitivity, 2.2µA Packet-Level-Duty-cycled Wake-Up Receiver with ADPLL achieving -30dB SIR”, in IEEE Custom Integrated Circuits Conference (CICC), 2023.
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N. Ownby, Singaraju, P., Bhattacharya, S., Calhoun, B. H., and Bowers, S. M., “A Sub-uW Digital Temperature Compensation Architecture for Arbitrary Voltage and Current Reference Generation”, in 2025 IEEE International Symposium on Circuits and Systems (ISCAS), In Press.