A 2-Dimensional mm-scale Network-on-Textiles (kNOTs) for Wearable Computing with Direct Die-to-Yarn Integration of 0.6mm x 2.15mm SoC and bySPI chiplets

A. Agrawal, Chen, Z., Desman, B. E., Wang, J., Tanaka, A., Foysal, F., Hess, C. D., Farrell, W., Owens, J., Truesdell, D. S., and Calhoun, B. H., “A 2-Dimensional mm-scale Network-on-Textiles (kNOTs) for Wearable Computing with Direct Die-to-Yarn Integration of 0.6mm x 2.15mm SoC and bySPI chiplets”, in 2025 IEEE International Solid-State Circuits Conference (ISSCC), In Press.